| PART |
Description |
Maker |
| VDSP-BLKFN-PC-FULL |
VisualDSP Development and Debugging Environment
|
Analog Devices
|
| 75KTA162134 |
Network Search Engine Development Board for the IntelIXDP2401 IXDP2801 and IXDP2851 Development Platforms
|
Integrated Device Technology, Inc.
|
| 75KTA062134-200 |
Network Search Engine Development Board for the Intel? IXDP2400 Development Platform
Network Search Engine Development Board for the Intel㈢ IXDP2400 Development Platform
|
Integrated Device Technology
|
| CONFIG2 CONFIG0 CONFIG1 DSUMFT311EV |
The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.
|
Future Technology Devices International Ltd.
|
| CY3653 |
WirelessUSB PRoC Development Kit Tutorial(无线USB PRoC开发工具指 的WirelessUSB PRoC开发套件教程（无线的USB的PRoC开发工具指南）
From old datasheet system
WirelessUSB PRoC(TM) Development Kit
|
Cypress Semiconductor Corp.
|
| DLP-IO16 |
DLP-IO16 Development System
DLP-IO16 Development System
|
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| ZSP |
ZSP SDK Software Development Kit user＇s guide rev4.0 5/02 ZSP的SDK软件开发工具包用户指南rev4.0 5 / 02
ZSP SDK Software Development Kit user锛? guide rev4.0 5/02
|
Bourns, Inc.
|
| EV42-160-22-SERIES EV44-100-22-SERIES EV44-160-22- |
TLC2555 Evaluation Module
TLC4545 Evaluation Module
TLC2551 Evaluation Module
CC1000DK-868/915 MHz Development Kit
CC2400DK Development Kit
TPA0172 Evaluation Module
Radiomodem 433 MHz
CC2400DBK Demonstration Board Kit
CC1000PP 433 MHz Plug and Play Module
Digital Data Capture and Analysis for High Speed, High Resolution A to D Converters
ADS1244 Evaluation Module
SN65HVD22EVM Evaluation Module
Peripheral IC 外围芯片
|
Infineon Technologies AG
NXP Semiconductors N.V.
Amphenol, Corp.
Xicon Passive Components
Electronic Theatre Controls, Inc.
|
| TFS770 |
Development Specification
|
VECTRON[Vectron International, Inc]
|
| ATSAM4S-EK |
Development Board
|
ATMEL Corporation
|
| TFS810 |
Development Specification
|
VECTRON[Vectron International, Inc]
|
| FCBGA |
Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)
|
Amkor Technology
|
